GC G-Premio Universal Bond – 8th Generation Dental Adhesive

GC G-Premio Universal Bond is a universal, 8th generation bonding agent compatible with total-etch, self-etch and selective etch techniques, providing excellent versatility. Perfectly adapted to all direct restorations and can also be used to repair indirect restorations without the use of primer. Can be used in combination with a silane when repairing glass or hybrid ceramic, and is also ideal for hypersensitivity treatment. Available in a 5 mL bottle with a new silicone cover for more precise drop dispensing.

A unique combination of three functional monomers (4-MET, MDP and MDTP), notably excluding HEMA, ensures excellent stability and exceptional bond strengths — not just to tooth tissue but to all indirect substrates, including composites, precious and non-precious metals, zirconia and alumina for all repair cases.

Key Features

• Zero debonding – High & durable bond to tooth structure and indirect substrates thanks to 3 functional monomers
• Zero discolorations – Extremely thin film thickness (3µm) and strong bonding layer with high filler content
• Zero post-operative sensitivity – Dentin tubules are sealed in all etching modes
• Zero mistakes – Clear procedure and very low technique-sensitivity
• Zero hassle – One bottle for many uses & excellent handling with optimal wettability and long working time
• Zero waste – Short procedure & economical dispensing with 300 drops per bottle

Benefits

• Low pH (1.5) provides effective and consistent bonding
• Use in all total-etch, self-etch and selective etch bonding techniques
• Low film thickness (3 microns) enables use with resin cements to bond indirect restorations
• Universal (8th generation) bonding agent for direct and indirect procedures and treatment of hypersensitivity
• Up to 5 minutes working time
• Consistent bond strength with easy application
• Better dispensing control and less waste with new silicone bottle design
• Fast technique: 10 second placement and 25 seconds before placing composite

Packing

1 x 5mL bottle

Composition

• Acetone
• Dimethacrylate
• Phosphoric acid ester monomer
• Dimethacrylate component
• Photoinitiator
• Butylated hydroxytoluene (BHT)

Light Curing Time

• Halogen / LED (700–1200 mW/cm²): 10 sec (<10mm) / 20 sec (>10mm)
• High power LED (>1200 mW/cm²): 5 sec (<10mm) / 10 sec (>10mm)

Directions for Use

1. Leave undisturbed for 10 seconds after application.
2. Dry thoroughly for 5 seconds under MAXIMUM air pressure and light cure for 10 seconds.
3. For selective etching approach, apply 35%–40% phosphoric acid on enamel for 10 seconds prior to bonding application.

Application Time: 30 seconds from application to light-cure
Bonding Layer Thickness: Less than 3 µm